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KD-2465 COB packaging glue
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KD-2465 COB packaging glue

Description:

This product is a two-component plus molding, without solvent, high purity of heat curing organic silicon encapsulating materials, mainly is suitable for the leds. Cured products can protect the chip and micro connections from external damage, resistance to environment pollution, the effects of moisture, shock, vibration, etc. This product is available in a wide range of temperature, humidity and the rough environment of optical properties, physical and mechanical properties and electrical performance stability, can meet various kinds of packaging.

INFOMATION

Product features:

High light transmittance, high purity

Excellent electrical and physical and mechanical properties

Suitable for reflow soldering process

Heat resistance superior performance

UV resistance is strong, low light failure

A good bonding effect, wide application scope

1, product introduction

This product is a two-component plus molding, without solvent, high purity of heat curing organic silicon encapsulating materials, mainly is suitable for the leds. Cured products can protect the chip and micro connections from external damage, resistance to environment pollution, the effects of moisture, shock, vibration, etc. This product is available in a wide range of temperature, humidity and the rough environment of optical properties, physical and mechanical properties and electrical performance stability, can meet various kinds of packaging.

2, typical physical properties

Before curing
ComponentAB
AppearanceTransparent flow of liquid
Viscosity rangeBefore Mix5500 cps2200 cps
After Mix3400 cps
After mix refractive index(ND25)1.41
Impurity contentK+≤2ppm、Na+≤2ppm
After curing
Light transmittance,2mm≥95%(450nm)
Light decay (6000 hours)≤2%
hardness (Shao)60±5A
Volume resistivity (Ω.cm)1015Ω.cm
Linear thermal expansion coefficient(ppm/k)<260
Method of application
AB component proportionA:B = 1:1
Curing temperature1 hour/80℃+3 hours/150 ℃
Cure time4 hours
Operating time8 hours
Storage conditions
Storage temperatureRoom temperature storage, conditional storage at low temperature
Storage timeSix month

3, the instructions

3.1 before using this product, the substrate surface should be kept clean and dry. Can remove the moisture on the surface of the substrate heating; Can be used without solubility and corrosive suitable solvent, such as naphtha, acetone, etc.) clean surface of base material.

3.2 according to the mixed proportion of recommended A/B = 1:1 (weight ratio), accurate weighing to clean containers, and fully mixing, vacuum deaeration.

3.3 In order to ensure the operability of the rubber,A, B After Mix use up within an hour.

3.4 packaging good chip into the oven curing, such as the recommended curing condition, the customer can be adjusted according to actual conditions.

4, product packaging and shipping

This article points A and B component, specifications for bottled 500 g / 500 g/A and B. Such products are non-dangerous goods, according to the general chemical transportation.

5, product storage

Part A and part B must be sealed separately stored in A cool, ventilated, indoor below 25 ℃, shelf life Six month.

6, matters needing attention

1. Part A and part B must be kept sealed, after opening has not used up still must cover letter, avoid contact with moisture in the air.

2. The product is prohibited to contact nitrogen, phosphorus, sulfur, acetylene, vinyl, peroxide and lead, tin, cadmium and other metal compound, and avoid causing catalyst poisoning effect curing effect.

The reliable data for the laboratory measured above, only for the user test and used as a reference. Because of equipment, materials, operations, such as is not the same, we can't to guarantee individual circumstances, including patent rights, please cond


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