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KD-2362 LED filament glue & packaging glue
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KD-2362 LED filament glue & packaging glue

Description:

This product is designed for filament LED resistance to high temperature of two-component molding LED encapsulation adhesive. Product resistance of 180 ℃ high temperature for a long time, the instantaneous high temperature 300 ℃, and the circuit board, sapphire, quartz glass, transparent ceramics such as stent has good adhesion, good product after curing light transmittance; High lumen value; Resistance to high temperature aging performance.

INFOMATION

Product features:

High light transmittance, high refractive index, high purity, excellent thixotropy.

Excellent electrical and physical and mechanical properties

Suitable for reflow soldering process

Heat resistance superior performance

UV resistance is strong, low light failure

Product of sapphire and bonding performance of glass and ceramics, the firm bonding of filament stents, bond lasting;

1, product introduction

This product is designed for filament LED resistance to high temperature of two-component molding LED encapsulation adhesive. Product resistance of 180 ℃ high temperature for a long time, the instantaneous high temperature 300 ℃, and the circuit board, sapphire, quartz glass, transparent ceramics such as stent has good adhesion, good product after curing light transmittance; High lumen value; Resistance to high temperature aging performance.

2, typical physical properties

Before curing
ComponentAB
AppearanceLight white transparentLight white transparent
Viscosity rangeBefore Mix30000cps20000cps
After Mix23000cps
After mix refractive index(ND25)1.43
Impurity contentK+≤2ppm、Na+≤2ppm
After curing
Light transmittance,2mm90%(450nm)
hardness (Shao)60±5A
Tensile Strength (MPa)>3.5
Volume resistivity (Ω.cm)1015Ω.cm
Linear thermal expansion coefficient(ppm/k)<280
Method of application
AB component proportionA:B = 1:1
Curing temperature1 hour/60℃+3 hours/150 ℃
Cure time4 hours
Operating time8 hours
Storage conditions
Storage temperatureRoom temperature storage, conditional storage at low temperature
Storage timeSix month

3, the instructions

3.1, support dehumidification: stay wrapped filament scaffold to clean and high temperature (150 degrees of above 1 h) and dehumidifying;

3.2, with glue: depending on the number is expected to use the glue, accurate weighing A certain quality of A agent and the corresponding percentage of B agent.

3.3, deaeration: will match good silicone fully mixing, and the bubble complete removal.

After 3.4, dispensing: determine the silicone no bubble, dispensing.

3.5, cure: put encapsulated stents in blast oven curing, recommended curing conditions for 1 hour / 60 ℃ / 150 ℃ + 3 hours.

4, product packaging and shipping

Points A and B components, specifications for 500 g plastic bottles or 5-25 l plastic packaging (other packaging according to customer requirements). Such products are non-dangerous goods, according to the general chemical transportation.

5, product storage

Part A and part B must be sealed separately stored in A cool, ventilated, indoor below 25 ℃, shelf life Six month.

6, matters needing attention

6.1, the product before use, should guarantee the other kinds of packaging material is dry, avoid moisture infiltration.

6.2, encapsulation process, the journey on nitrogen, phosphorus, sulfur, vinyl, peroxide, lead, tin, cadmium and other metal compounds, avoid the silicon rubber curing of catalyst poisoning caused by incomplete.

The reliable data for the laboratory measured above, only for the user test and used as a reference. Because of equipment, materials, operations, such as is not the same, we can't to guarantee individual circumstances, including patent rights, please cond


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