KD-803 Heat conduction filling and sealing glue
This product is a two-component molding pouring sealant of thermal conductivity, is mainly used for electronic components, power supply module and a printed circuit board and vehicle electrical insulating heat conduction, waterproof sealing protection.
INFOMATION
Product features:
·The curing shrinkage, heat release
·Temperature tolerance range (- 50 ℃ to 200 ℃)
·Good insulation
·Waterproof and moistureproof, no corrosion
·Conform to the requirements of the RoHS directive
·Certified by UL flame retardant
1, product introduction
This product is a two-component molding pouring sealant of thermal conductivity, is mainly used for electronic components, power supply module and a printed circuit board and vehicle electrical insulating heat conduction, waterproof sealing protection.
2, typical physical properties
| Test Items | Unit | Reference Standard | Numerical | |
| Before curing | Appearance | / | / | A component white |
| B component white | ||||
| Viscosity | cps | GB/T2794-1995 | A:5200 | |
| B:3400 | ||||
| Density | g/cm3 | GB/T2794-1995 | A:1.57 | |
| B:1.54 | ||||
| After Mix | Use ratio | / | / | 1:1 |
| Mix viscosity | cps | GB/T2794-1995 | 4000 | |
| Operating time | min | / | 60 | |
| Cure time | h | / | 6 | |
| After curing | Hardness | Shore A | GB/T531-1999 | 54 |
| Breakdown voltage | kv/mm | GB/T1408.1-1999 | 10 | |
| Volume resistivity | Ω·cm | GB/T1692-92 | ≥1.0×1014 | |
| Permittivity | 60Hz | GB/T1694-1981 | 3.0 | |
| Heat conductivity coefficient | w/m·k | / | 0.6 | |
Test environment:（25℃、RH:65%）
3, the instructions
Weighing, weighing A and B components according to the proportion of 1:1 (quality) mix. (A and B components separately before weighing fully stir well, packing and evenly dispersed to make A settlement adhesive solution, lest affect colloid performance);
Rubber mixing: by hand or machine will rubber mixing fully, make the color of the rubber homogeneously. Manual method of mixed one-time resin with not too much should be paid more attention to, in order to avoid the late illiquidity difficult to glue;
Deaeration: puts rubber mixing vacuum deaeration, contained in the removal of entrained air mixing process in vacuum way;
Potting: finish off the bubble rubber filling into the device complete potting operation (before sealing device and mixed with the surface of the container should be kept clean and dry).
Curing: the potting curing at room temperature and heating device. Colloid mixture will extend the viscosity will increase gradually, as time control in the suitable operation time should be paid attention to potting.
4, product packaging and shipping
Points A and B component, 40 kg/set of specifications for (A component 20 kg + B component 20 kg). Such products are non-dangerous goods, according to the general chemical transportation.
5, product storage
Part A and part B must be sealed separately stored in A cool, ventilated, dry, 27 ℃ below the warehouse, banned direct sunlight, the shelf life of 6 months.
6, matters needing attention
1. Part A and part B must be kept sealed, after opening has not used up still must cover letter, avoid contact with moisture in the air.
2. The product is prohibited to contact nitrogen, phosphorus, sulfur, acetylene, vinyl, peroxide and lead, tin, cadmium and other metal compound, and avoid causing catalyst poisoning effect curing effect.
The reliable data for the laboratory measured above, only for the user test and used as a reference. Because of equipment, materials, operations, such as is not the same, we can't to guarantee individual circumstances, including patent rights, please conduct a comprehensive test prior to use, and then to decide the most appropriate method of use.
