Name:
Heat conduction silica gel
Description:
Mainly used for both requirements for insulation, flame retardant and heat dissipation requirements of removable power of thermal conductivity of pipe and precision instruments, use it to fill in the transistor between shell and radiator panels, radiators, in order to increase the cooling effect. Strong bonding, when using, no additional mechanical fixation.
INFOMATION
| Model | One-component seal glue | |
| Type | Heat conduction silica gel | |
| Before curing | Appearance（visual） | White, red liquid glue |
| Viscosity Pa.s | 5-40 | |
| Surface Solidify Time min | 15-60 | |
| After curing | Temperature ℃ | -60-300 |
| Tensile Strength MPa≥ | 1.0 | |
| Elongation at break %≥ | 160 | |
| Shear strength (L—L) MPa≥ | 1.1 | |
| hardness A | 20-30 | |
| Volume resistivity Ω.cm | 1.0×1014 | |
| Permittivity (1MHz) ≥ | 2.5 | |
| Dielectric loss tangent value（1MHz）≤ | 5×10-3 | |
| Dielectric strength KV/mm≥ | 12 | |
| Maximum depth solidification mm | 5-8 | |
| Features & Applications | Mainly used for both requirements for insulation, flame retardant and heat dissipation requirements of removable power of thermal conductivity of pipe and precision instruments, use it to fill in the transistor between shell and radiator panels, radiators, in order to increase the cooling effect. Strong bonding, when using, no additional mechanical fixation. | |
